Electronic materials (printed wiring boards, insulating materials, etc.)
Features
Electronic components generally require high adhesion to ensure stable and durable signal transmission and to improve the reliability of components and substrates.
In general, high adhesion is required for electronic components to ensure stable signal transmission and durability, and to improve the reliability of components and boards.In addition, insulation is required to eliminate interference between circuits.
Application
Electronic parts (components) ー Printed circuit boards, battery cases, etc.
Required Performance
| Adhesion | Special Adhesion Treatment |
|---|---|
| Insulation | Anodized alumite* (Alumite) |
※Insulation properties vary depending on the thickness of the film.
Recommended coating thickness for various surface treatments
| Type | Designation | Film thickness | |
|---|---|---|---|
| Hard anodizing | HA | 20～80µm | Hard anodizing |
| Superanodizing | SA | 10～30µm | Superanodizing |
| Sulfuric acid anodized alumite | AA | 3～25µm | Sulfuric acid anodized alumite |